JPS6345001Y2 - - Google Patents

Info

Publication number
JPS6345001Y2
JPS6345001Y2 JP7206982U JP7206982U JPS6345001Y2 JP S6345001 Y2 JPS6345001 Y2 JP S6345001Y2 JP 7206982 U JP7206982 U JP 7206982U JP 7206982 U JP7206982 U JP 7206982U JP S6345001 Y2 JPS6345001 Y2 JP S6345001Y2
Authority
JP
Japan
Prior art keywords
pressure surface
bonding
angle
wedge
thin wire
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP7206982U
Other languages
English (en)
Japanese (ja)
Other versions
JPS58175634U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP7206982U priority Critical patent/JPS58175634U/ja
Publication of JPS58175634U publication Critical patent/JPS58175634U/ja
Application granted granted Critical
Publication of JPS6345001Y2 publication Critical patent/JPS6345001Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78313—Wedge
    • H01L2224/78314—Shape
    • H01L2224/78317—Shape of other portions
    • H01L2224/78318—Shape of other portions inside the capillary

Landscapes

  • Wire Bonding (AREA)
JP7206982U 1982-05-19 1982-05-19 ボンデイングウエツジ Granted JPS58175634U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP7206982U JPS58175634U (ja) 1982-05-19 1982-05-19 ボンデイングウエツジ

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP7206982U JPS58175634U (ja) 1982-05-19 1982-05-19 ボンデイングウエツジ

Publications (2)

Publication Number Publication Date
JPS58175634U JPS58175634U (ja) 1983-11-24
JPS6345001Y2 true JPS6345001Y2 (en]) 1988-11-22

Family

ID=30081652

Family Applications (1)

Application Number Title Priority Date Filing Date
JP7206982U Granted JPS58175634U (ja) 1982-05-19 1982-05-19 ボンデイングウエツジ

Country Status (1)

Country Link
JP (1) JPS58175634U (en])

Also Published As

Publication number Publication date
JPS58175634U (ja) 1983-11-24

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